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NEC developed Ru / Ti barrier layer laminated material and TaOx high dielectric materials

Research Institute has developed two new technologies, the new type of semiconductor device structures and thin film preparation techniques. The former is the 32nm process for the new barrier layer copper wiring structure. Through the use of ruthenium and other materials, copper cabling to achieve high reliability and low resistance; which is applicable to future 45nm process changes in suppression of supply voltage (power noise) technology. To suppress power supply noise caused by malfunction in the upper cu multilayer formation of tantalum oxide high dielectric materials, components,[link widoczny dla zalogowanych], and the development of a tantalum oxide film materials technology. cu wiring structure of a new barrier to the miniaturization as LSI devices, the direction of the development of multi-layer wiring, cabling and increasing the resistance of contacts, it is necessary to improve on the barrier film. Barrier materials to prevent the copper wiring insulation membrane si02 spread to the layer of thin film system. Prior to using the Ta / TaN diffusion of cu blocking better, but the crystallization of matching cu film (adhesion) is poor, prone to breakage. The Ru and cu good adhesion, and resistance is much smaller than the TaN,[link widoczny dla zalogowanych], but not because of the proliferation of 82,008 cu 1O on the role of blocking, it is not practical. The development of film growth in the Ti film Ru Ru / Ti barrier layer laminated to solve the above problems. The Ru / Ti multilayer film structure is to spread to the Ru Ti grain boundaries,[link widoczny dla zalogowanych], the Ru layer has a barrier performance. With the Ru / Ti instead of TaN as a barrier layer, can plug wiring connecting the upper and lower resistance at the 70% decline. In addition, the Ru / Ti barrier layer of Ti to the lower part of the underlying cu jack wiring trace diffusion, can inhibit the migration of lead to disconnection of electricity, the wiring life 35 times longer than the original. Power supply noise suppression performance with LSI to develop in the direction has great influence on the reliability of power supply noise suppression method further research, the upper wiring layers formed in the MIM (metal one insulating film of a metal) capacitors element method. NEC Electronics Corporation to achieve the components of large capacity (high dielectric constant of) the purpose, has taken measures to reduce the insulation thickness, but the 45nm process requirements beyond the capacity for further increases, the insulating film must be converted to high dielectric constant materials. The company will insulating SiN film material converted from the traditional TaOx. Growth TaOx film before heat treatment must be carried out, the company has developed the following at 350 ℃ Ta into the metal TaOx the \As can continue to use the existing plasma CVD device, it will not increase costs. In addition, the use of TiN / Ta / TiN multilayer structure of the ultra-flat lower electrode, so that power supply noise reduction to the previous half. (Yang Xiaochan translation) developed by Mitsui Metal diesel exhaust gas purification catalyst for Mitsui silver metallic silver on behalf of the company developed a new type of platinum catalyst for diesel exhaust gas purification device (DPF: Diesel particulate filter). The catalyst can be maintained on the granular material platinum catalyst (PM) of the purification capacity, and to reduce the cost of precious metals with more than 90%. 2019. Years later, Japan, Europe and the implementation of construction machinery, agricultural machinery,[link widoczny dla zalogowanych], generators and other industrial machinery, diesel engines discharge limits. This will bring about 50 billion catalyst industry, said element of the market. Currently, the new catalyst used only for industrial machinery, trucks and cars will be involved in future market. The silver coating on the ceramic catalyst on the DPF can be removed at a low temperature combustion of PM. Previously, the use of materials other than platinum, due to purification performance and durability problems, it is difficult to practice. Mitsui Metals, silver and other metals by the mixed oxide composition, the heat resistance at 800 ℃ or so. Real machine evaluation results show that the catalyst performance in the PM and the platinum catalyst combustion considerable. Silver catalyst and the platinum catalyst in the different aspects of PM combustion mechanism. Because the oxygen absorption and release of silver catalyst ability, so the surface of the active oxygen catalyst can effectively burn PM. In the absence of NOx combustion conditions,[link widoczny dla zalogowanych], the platinum catalyst at 600 ~ C to be under the PM combustion, while the silver catalyst at 400 ℃ # KJN P Ⅳ I can make fire. (Yang Xiaochan translation) nanoparticles formed by the dye solar modules Fraunhofer Institute in Germany announced that an organic dye nano-particles can transform sunlight into electricity. The Institute has made a wide 60cm, high-2m solar panels samples. By screen printing technique applied to the glass on the nano-particles. The technology of nano particles in glass can be printed on any graphics. This material can be made with the decorative facade, the company can achieve the effect of publicity, but also to generate electricity. (Yang Yinghui translation) 9

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